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Heat Sink, 14 °C/W, TO-268, 12.7 mm, 10 mm, 31 mm

AAVID / BOYD 573400D00000G

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573400D00000G   Datasheet
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Technical Docs (1)

Product Overview

The 573400D00000G is a surface-mount Heat Sink with tin-plated finish for use with D3 Pak (TO-268) package semiconductors. Its unique design removes heat indirectly through conduction without making contact with the SMT device like traditional through-hole solutions. The semiconductor's conventional copper drain pad is modified to extend beyond the edges of the semiconductor package providing space to mount the heat sink. The device and heat sink are soldered directly to the modified drain pad creating a thermal transfer path from the package tab to the surface mount heat sink. The elevated "Wings" of the heat sink provide ample surface area to dissipate the heat into the surrounding environment.
  • Horizontal mount orientation
  • No attachment holes required in the printed circuit board
  • Wing configuration will not interfere with adjacent components
  • Compatible with both tin-lead and lead free (Sn/Ag/Cu) solders


HVAC, Thermal Management, Consumer Electronics, Communications & Networking, Motor Drive & Control, Automation & Process Control, Industrial, Medical

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