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60-5-10

Desoldering Braid, Soder-Wick®, No-Clean, Static Dissipative Bobbin, 0.15" x 10 ft

CHEMTRONICS 60-5-10

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Manufacturer Part No:
60-5-10
Order Code:
860712
Technical Datasheet:
60-5-10   Datasheet
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Oxygen Free Copper

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3.68mm

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3.048m

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Technical Docs (2)

Product Overview

The 60-5-10 is a Soder-Wick® No Clean Desoldering Braid designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick® No Clean uses pure, oxygen-free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick® No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity. The Soder-Wick® No Clean SD safely removes solder in all applications requiring type ROL0 flux. BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes. The Soder-Wick® No Clean safely removes solder from micro circuits, surface mount device pads, ball grid array pads, lugs and posts.
  • Brown label on SD bobbin
  • Minimizes the risk of damage associated with static electricity
  • Patented non-corrosive, halide-free and organic no-clean flux
  • Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
  • Requires little or no post solder cleaning
  • No corrosive residues
  • Minimal risk of heat and static component damage
  • Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for surface insulation resistance
  • Packaged in ESD-safe static dissipative bobbins

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RM50.25

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