Collect - Edge Devices (Sensors & Actuators)

This is the front-most device of any IoT system. It primarily works as either a sensing device to collect physical environment information, or as an actuator to control the outside world with an output. In some cases, edge devices perform a dual role, acting as both a sensing and actuating device to collect and control the physical environment.


The edge node must be connected to the outside network, either through a wired or wireless sensor node (WSN). Data integrity remains key in this block of the signal chain as many IoT systems utilize a large number of sensors to collect data and make intelligent decisions.


An edge node device provides the intelligence to sense, measure, interpret, and connect an internet gateway to the cloud. The data can be pre-processed with some form of analytics before it is transmitted for deeper data mining intelligence.


Processing nodes provides local intelligence to the entire network of sensors and applications. Typically, a processing node involves one or more microcontroller, microprocessor, hybrid circuit, etc. and may be relatively larger in size as compared to end-nodes. Processing nodes are not readily available devices; they are custom made by designers to meet the specific needs of their application.


Bigger IoT applications require a large array of edge devices in order to form a network of edge devices. In such cases, each edge device (node) needs to have a unique identifier in order to recognise and communicate with them effectively.


Typical examples of Edge Devices (Nodes):


Sensors: Temperature, Humidity, Pressure, Gas, Light, Sound, RFID, NFC, Ultrasonics, Flow Meter, Fluid, Cameras, etc


Actuators: Switch, Relays, PLCs, Motors, Light, Sound etc


Videos

TI IoT Week, Sensor Node Project

Smart Occupancy Sensor training video for IoT Solutions from Silicon Labs

Atmel: IoT-Enabled Temperature Sensor Demo

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MAXREFDES117#
MAXREFDES117# - Reference Design Board, Optical Heart Rate and Pulse-Oximetry Monitor, Integrated Red and IR LEDs

2627165

MAXIM INTEGRATED PRODUCTS - Reference Design Board, Optical Heart Rate and Pulse-Oximetry Monitor, Integrated Red and IR LEDs

REF DES BRD, HEART RATE/PULSE OXIMETER; Silicon Manufacturer:Maxim Integrated Products; Silicon Core Number:MAX30102, MAX14595, MAX1921; Kit Application Type:Sensor; Application Sub Type:Pulse Oximeter & Heart Rate Monitor; Core Architecture:-; Core Sub-

  • 14 available for next business day delivery
  • 218 available for 4 - 6 business days delivery
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  • 14 available for next business day delivery: Order before 16:00 Mon-Fri (excluding National Holidays)
  • 218 available for 4 - 6 business days delivery: Order before 16:00 Mon-Fri (excluding National Holidays)

More stock available week commencing 1/14/19

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1+ RM111.27 5+ RM105.76

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Min: 1 Mult: 1
LDC1000EVM
LDC1000EVM - Evaluation Module, LDC1000 Inductance to Digital Converter for Inductive Sensing Applications, 5V

2360423

TEXAS INSTRUMENTS - Evaluation Module, LDC1000 Inductance to Digital Converter for Inductive Sensing Applications, 5V

INDUCTIVE SENSING, EVALUATION BOARD; Kit Application Type:Data Converter; Silicon Manufacturer:Texas Instruments; Silicon Core Number:LDC1000; Application Sub Type:Inductance to Digital Converter; Kit Contents:Evaluation Board LDC1000; Product Range:-; S

  • 6 available for next business day delivery
  • 5 available for 4 - 6 business days delivery
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  • 6 available for next business day delivery: Order before 16:00 Mon-Fri (excluding National Holidays)
  • 5 available for 4 - 6 business days delivery: Order before 16:00 Mon-Fri (excluding National Holidays)

More stock available week commencing 3/18/19

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1+ RM173.65

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Min: 1 Mult: 1
AMG8834EK
AMG8834EK - Evaluation Board, AMG8834 Infrared Grid-EYE Array Sensor, PAN1740 Bluetooth Low Energy Module

2664539

PANASONIC ELECTRONIC COMPONENTS - Evaluation Board, AMG8834 Infrared Grid-EYE Array Sensor, PAN1740 Bluetooth Low Energy Module

GRID-EYE SENSOR BOARD; Kit Application Type:Sensor; Silicon Manufacturer:Panasonic; Silicon Core Number:AMG8834; Application Sub Type:Infrared Array Sensor; Kit Contents:Grid-EYE Sensor Board, ATSAMD21- SMART, Bluetooth Module; Product Range:-; SVHC:No S

  • 14 available for next business day delivery
  • 34 available for 4 - 6 business days delivery
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  • 14 available for next business day delivery: Order before 16:00 Mon-Fri (excluding National Holidays)
  • 34 available for 4 - 6 business days delivery: Order before 16:00 Mon-Fri (excluding National Holidays)

More stock available week commencing 2/11/19

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1+ RM321.71

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2011660
2011660 - Evaluation Module, Laser Diode Driver, Integrated Reverse Polarity Protection for IC & Laser Diode

1272670

LASER COMPONENTS - Evaluation Module, Laser Diode Driver, Integrated Reverse Polarity Protection for IC & Laser Diode

LASER DIODE DRIVER, DEV KIT; Kit Application Type:Drivers; Silicon Manufacturer:Laser Components; Silicon Core Number:-; Application Sub Type:Laser Diode Driver; Kit Contents:Evaluation Board WK Module; Product Range:-; SVHC:No SVHC (15-Jan-2018); Featur

  • 7 available for next business day delivery
  • 92 available for 4 - 6 business days delivery
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  • 7 available for next business day delivery: Order before 16:00 Mon-Fri (excluding National Holidays)
  • 92 available for 4 - 6 business days delivery: Order before 16:00 Mon-Fri (excluding National Holidays)

More stock available week commencing 12/31/18

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1+ RM44.33 10+ RM41.37 25+ RM36.52

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BRKT-STBC-AGM01
BRKT-STBC-AGM01 - Development Platform, FXAS21002C & FXOS8700C 9-Axis Solution, Sensor Shield and Breakout Board

2473788

NXP - Development Platform, FXAS21002C & FXOS8700C 9-Axis Solution, Sensor Shield and Breakout Board

BREAKOUT BOARD, FREEDOM INERTIAL SENSOR; Silicon Manufacturer:NXP; Core Architecture:ARM; Core Sub-Architecture:Cortex-M4; Silicon Core Number:FXAS21002C, FXOS8700CQ; Silicon Family Name:-; For Use With:NXP FRDM-K64F-AGM01 Demonstration kit; Kit Contents

  • 2 available for next business day delivery
  • 44 available for 4 - 6 business days delivery
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  • 2 available for next business day delivery: Order before 16:00 Mon-Fri (excluding National Holidays)
  • 44 available for 4 - 6 business days delivery: Order before 16:00 Mon-Fri (excluding National Holidays)

More stock available week commencing 3/18/19

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1+ RM70.54

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FRDM-FXS-MULT2-B
FRDM-FXS-MULT2-B - Evaluation Module, MMA8652FC/FXAS21002C/MPL3115A2 3-Axis Accelero/Magneto/Gyroscope

2520442

NXP - Evaluation Module, MMA8652FC/FXAS21002C/MPL3115A2 3-Axis Accelero/Magneto/Gyroscope

DEV BOARD, FREEDOM PLATFORM; Kit Application Type:Sensing - Navigation, Position; Silicon Manufacturer:NXP; Silicon Core Number:FXLS8471Q, MAG3110, FXAS21002C, MMA8652FC, MPL3115A2, FXOS8700CQ, MMA9553L; Application Sub Type:Sensor; Kit Contents:Freedom

  • 45 available for 4 - 6 business days delivery
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MAX31855PMB1#
MAX31855PMB1# - Evaluation Module, MAX31855 K-Type Thermocouple to Digital Converter, 14-Bit Output

2530496

MAXIM INTEGRATED PRODUCTS - Evaluation Module, MAX31855 K-Type Thermocouple to Digital Converter, 14-Bit Output

DEV BOARD, THERMOCOUPLE-DIGITAL; Kit Application Type:Sensing - Temperature; Silicon Manufacturer:Maxim Integrated Products; Silicon Core Number:MAX31855; Application Sub Type:Thermocouple to Digital Converter; Kit Contents:Dev Board MAX31855( K Type The

  • 39 available for 4 - 6 business days delivery
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  • 39 available for 4 - 6 business days delivery: Order before 16:00 Mon-Fri (excluding National Holidays)

More stock available week commencing 1/14/19

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SEK001
SEK001 - Evaluation Kit, Trustability Pressure Sensors, Digital Output

2772519

HONEYWELL - Evaluation Kit, Trustability Pressure Sensors, Digital Output

SENSOR EVALUATION KIT, PRESSURE SENSOR; Kit Application Type:Sensor; Silicon Manufacturer:Honeywell; Silicon Core Number:-; Application Sub Type:Board Mount Pressure Sensors; Kit Contents:Sensor Evaluation Kit; Product Range:-; SVHC:No SVHC (07-Jul-2017)

  • 36 available for 4 - 6 business days delivery
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SI7057-EVB
SI7057-EVB - Evaluation Kit, Si705x Processor Family, Temperature Sensor, USB Dongle Form Factor

2769165

SILICON LABS - Evaluation Kit, Si705x Processor Family, Temperature Sensor, USB Dongle Form Factor

EVAL BOARD, DIGITAL TEMPERATURE SENSOR; Kit Application Type:Sensor; Silicon Manufacturer:Silicon Laboratories; Silicon Core Number:Si7057, Si7058 & Si7059; Application Sub Type:Temperature Sensor; Kit Contents:USB Dongle Control & Si7057-EB Postage Stam

  • 26 available for 4 - 6 business days delivery
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EVAL-ADXL377Z
EVAL-ADXL377Z - Breakout Board, ADXL377 3-Axis High g Analog MEMS Accelerometer

2250738

ANALOG DEVICES - Breakout Board, ADXL377 3-Axis High g Analog MEMS Accelerometer

EVALUATION BOARD, 3 AXIS ACCEL; Kit Application Type:Sensing - Navigation, Position; Silicon Manufacturer:Analog Devices; Silicon Core Number:ADXL377; Application Sub Type:Accelerometer - Three-Axis; Kit Contents:Evaluation Board ADXL377; Product Range:A

  • 47 available for 4 - 6 business days delivery
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More stock available week commencing 10/26/20

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1+ RM176.22

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FDC2114EVM
FDC2114EVM - Evaluation Module, FDC2114 12-Bit Capacitive Sensing Solution, Proximity Sensing, 4 Channel

2535921

TEXAS INSTRUMENTS - Evaluation Module, FDC2114 12-Bit Capacitive Sensing Solution, Proximity Sensing, 4 Channel

EVAL BOARD, FDC2114 CAP-TO-DIGITAL CONV; Kit Application Type:Sensing - Touch, Proximity; Silicon Manufacturer:Texas Instruments; Silicon Core Number:MSP430F5528, FDC2114; Application Sub Type:Capacitance-to-Digital Converter; Kit Contents:Evaluation Boa

  • 13 available for 4 - 6 business days delivery
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More stock available week commencing 1/7/19

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1+ RM167.20

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DM160225
DM160225 - Evaluation Board, PC Peripheral, 3DTouchPad, Extends 2D Touch Pad with 3D Gestures

2448429

MICROCHIP - Evaluation Board, PC Peripheral, 3DTouchPad, Extends 2D Touch Pad with 3D Gestures

DEV BOARD, PCAP SENSOR 3D TOUCH PAD; Kit Application Type:Sensing - Touch, Proximity; Silicon Manufacturer:Microchip; Silicon Core Number:MTCH63104, MGC3130; Application Sub Type:3D Tracking & Gesture Controller; Kit Contents:3DTouchPad, USB Cable, Infor

  • 4 available for 4 - 6 business days delivery
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More stock available week commencing 1/21/19

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1+ RM534.79

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SENSEKIT2-EVK-101
SENSEKIT2-EVK-101 - Evaluation Kit, LAPIS MCU, 6x Analog and Digital Ambient Light Sensor IC's, Hot Pluggable Design

2475523

ROHM - Evaluation Kit, LAPIS MCU, 6x Analog and Digital Ambient Light Sensor IC's, Hot Pluggable Design

EVAL BOARD, ML610Q112 SENSOR PLATFORM; Kit Application Type:Sensor; Silicon Manufacturer:-; Silicon Core Number:ML610Q112, BU52011HFV, BH1620FVC, BH1721FVC, ML8511, KMX61, BDE0600G; Application Sub Type:Embedded; Kit Contents:Sensor Platform Base Board,

  • 36 available for 4 - 6 business days delivery
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1+ RM139.09

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OM13081UL
OM13081UL - Evaluation Module, LPC82x Capacitive Touch Solution, 8-Bit Touchpad, 9 Keys, LCD

2471049

NXP - Evaluation Module, LPC82x Capacitive Touch Solution, 8-Bit Touchpad, 9 Keys, LCD

DEMO BOARD, CAP TOUCH SOLUTION; Kit Application Type:Sensing - Touch, Proximity; Silicon Manufacturer:NXP; Silicon Core Number:LPC824; Application Sub Type:Capacitive Touch; Kit Contents:Dev Board LPC824, LPC82x Touch Shield, USB Cable; Product Range:-;

  • 62 available for 4 - 6 business days delivery
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More stock available week commencing 2/25/19

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1+ RM127.29

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XTRINSIC-SENSORS-EVK
XTRINSIC-SENSORS-EVK - Evaluation Kit for NXP Xtrinsic Sensors using FRDM-KL25Z Platform

2308734

NXP - Evaluation Kit for NXP Xtrinsic Sensors using FRDM-KL25Z Platform

EVAL KIT, XTRINSIC SENSOR + KL25 BOARD; Kit Application Type:Sensing - Sampling Kit / Related Components; Silicon Manufacturer:NXP; Silicon Core Number:KL25Z, MAG3110, MMA8491, MPL3115; Application Sub Type:-; Kit Contents:Xtrinsic Sensor Board, Freedom

  • 766 available for 4 - 6 business days delivery
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  • 766 available for 4 - 6 business days delivery: Order before 16:00 Mon-Fri (excluding National Holidays)

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Available until stock is exhausted

1+ RM108.66

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FDC1004QEVM
FDC1004QEVM - Evaluation Module, FDC1004-Q1 Automotive 4-Channel Capacitive to Digital Converter, Plug & Play

2535928

TEXAS INSTRUMENTS - Evaluation Module, FDC1004-Q1 Automotive 4-Channel Capacitive to Digital Converter, Plug & Play

EVAL BRD, FDC1004-Q1 CAP-TO-DIGITAL CONV; Kit Application Type:Sensor Signal Conditioner; Silicon Manufacturer:Texas Instruments; Silicon Core Number:MSP430F5528IRGCT, FDC1004-Q1; Application Sub Type:Capacitance-to-Digital Converter; Kit Contents:Eval B

  • 8 available for 4 - 6 business days delivery
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  • 8 available for 4 - 6 business days delivery: Order before 16:00 Mon-Fri (excluding National Holidays)

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OPT3001EVM
OPT3001EVM - Evaluation Module, OPT3001 Ambient Light Sensor, Digital Output Integrated Circuit

2471704

TEXAS INSTRUMENTS - Evaluation Module, OPT3001 Ambient Light Sensor, Digital Output Integrated Circuit

EVALUATION BOARD, LIGHT SENSOR; Kit Application Type:Sensing - Navigation, Position; Silicon Manufacturer:Texas Instruments; Silicon Core Number:OPT3001; Application Sub Type:Light to Digital Converter; Kit Contents:Eval Board OPT3001, SM-USB DIG Board,

  • 11 available for 4 - 6 business days delivery
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  • 11 available for 4 - 6 business days delivery: Order before 16:00 Mon-Fri (excluding National Holidays)

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1+ RM140.06

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FDC2214EVM
FDC2214EVM - Evaluation Module, FDC2214 28-Bit Capacitance to Digital Converter, Small Form Factor

2499241

TEXAS INSTRUMENTS - Evaluation Module, FDC2214 28-Bit Capacitance to Digital Converter, Small Form Factor

EVAL BRD, FDC2214 CAPACITANCE TO DIGITAL; Kit Application Type:Sensing - Touch, Proximity; Silicon Manufacturer:Texas Instruments; Silicon Core Number:MSP430F5528, FDC2214; Application Sub Type:Capacitance-to-Digital Converter; Kit Contents:Eval Board MS

  • 8 available for 4 - 6 business days delivery
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  • 8 available for 4 - 6 business days delivery: Order before 16:00 Mon-Fri (excluding National Holidays)

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1+ RM167.20

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LDC0851EVM
LDC0851EVM - Evaluation Module, LDC0851 High Accuracy Inductive Switch, Stacked Coil, Push / Pull Output

2531097

TEXAS INSTRUMENTS - Evaluation Module, LDC0851 High Accuracy Inductive Switch, Stacked Coil, Push / Pull Output

EVALUATION BOARD, INDUCTIVE SWITCH; Kit Application Type:Sensing - Touch, Proximity; Silicon Manufacturer:Texas Instruments; Silicon Core Number:LDC0851; Application Sub Type:Inductive Proximity Switch; Kit Contents:Eval Board LDC0851, USB Cable; Product

  • 8 available for 4 - 6 business days delivery
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1+ RM112.70

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ADPD105BCPZ
ADPD105BCPZ - PHOTOMETRIC FRONT END, LFCSP-28

2725084

ANALOG DEVICES - PHOTOMETRIC FRONT END, LFCSP-28

PHOTOMETRIC FRONT END, LFCSP-28; IC Function:Photometric Front End; Supply Voltage Min:1.7V; Supply Voltage Max:1.9V; IC Package Type:LFCSP; No. of Pins:28Pins; Operating Temperature Min:-40°C; Operating Temperature Max:85°C; Product Range:-; MSL:MSL 3 -

  • 1 available for 4 - 6 business days delivery
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  • 1 available for 4 - 6 business days delivery: Order before 16:00 Mon-Fri (excluding National Holidays)

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1+ RM31.53 10+ RM28.50 490+ RM22.54 980+ RM20.55

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LDC1612EVM
LDC1612EVM - Evaluation Module, LDC1612 12-Bit Inductance to Digital Converter, Sample PCB Sensor Coils

2471702

TEXAS INSTRUMENTS - Evaluation Module, LDC1612 12-Bit Inductance to Digital Converter, Sample PCB Sensor Coils

EVAL BOARD, LDC1612; Kit Application Type:Sensing - Navigation, Position; Silicon Manufacturer:Texas Instruments; Silicon Core Number:MSP430F5528, LDC1612; Application Sub Type:Sensor; Kit Contents:Eval Board LDC1612; Product Range:-; SVHC:No SVHC (15-Ja

  • 4 available for 4 - 6 business days delivery
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  • 4 available for 4 - 6 business days delivery: Order before 16:00 Mon-Fri (excluding National Holidays)

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1+ RM165.03

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EK-H5
EK-H5 - Evaluation Kit for SHT2x and SHT7x Humidity and Temperature Sensors

1855471

SENSIRION - Evaluation Kit for SHT2x and SHT7x Humidity and Temperature Sensors

EVALUATION KIT, HUMIDITY, FOR SHT2X/7X; Kit Application Type:Sensor; Silicon Manufacturer:Sensirion; Silicon Core Number:SHT21; Application Sub Type:Humidity Sensor; Kit Contents:EK-H5 USB Stick, SHT21 Sensor, Sensor Cable; Product Range:-; SVHC:No SVHC

No Longer Manufactured