Collect - Edge Devices (Sensors & Actuators)
This is the front-most device of any IoT system. It primarily works as either a sensing device to collect physical environment information, or as an actuator to control the outside world with an output. In some cases, edge devices perform a dual role, acting as both a sensing and actuating device to collect and control the physical environment.
The edge node must be connected to the outside network, either through a wired or wireless sensor node (WSN). Data integrity remains key in this block of the signal chain as many IoT systems utilize a large number of sensors to collect data and make intelligent decisions.
An edge node device provides the intelligence to sense, measure, interpret, and connect an internet gateway to the cloud. The data can be pre-processed with some form of analytics before it is transmitted for deeper data mining intelligence.
Processing nodes provides local intelligence to the entire network of sensors and applications. Typically, a processing node involves one or more microcontroller, microprocessor, hybrid circuit, etc. and may be relatively larger in size as compared to end-nodes. Processing nodes are not readily available devices; they are custom made by designers to meet the specific needs of their application.
Bigger IoT applications require a large array of edge devices in order to form a network of edge devices. In such cases, each edge device (node) needs to have a unique identifier in order to recognise and communicate with them effectively.
Typical examples of Edge Devices (Nodes):
Sensors: Temperature, Humidity, Pressure, Gas, Light, Sound, RFID, NFC, Ultrasonics, Flow Meter, Fluid, Cameras, etc
Actuators: Switch, Relays, PLCs, Motors, Light, Sound etc
Getting Started
Browse Technologies
IoT Building Blocks
IoT Building Blocks
Resources
Applications Notes
Videos
TI IoT Week, Sensor Node Project
Smart Occupancy Sensor training video for IoT Solutions from Silicon Labs
Atmel: IoT-Enabled Temperature Sensor Demo
Contract pricing display is unavailable at the moment. Prices shown are standard retail prices, orders placed will have contract pricing applied when processed.
| Manufacturer Part No | Order Code | Manufacturer / Description | Avail | Price For | Price | Quantity | |
|---|---|---|---|---|---|---|---|
MAXREFDES117#
|
MAXIM INTEGRATED PRODUCTS - Reference Design Board, Optical Heart Rate and Pulse-Oximetry Monitor, Integrated Red and IR LEDs REF DES BRD, HEART RATE/PULSE OXIMETER; Silicon Manufacturer:Maxim Integrated Products; Silicon Core Number:MAX30102, MAX14595, MAX1921; Kit Application Type:Sensor; Application Sub Type:Pulse Oximeter & Heart Rate Monitor; Core Architecture:-; Core Sub- |
More stock available week commencing 8/19/19 |
Each |
1+ RM76.33 |
|||
2011660
|
LASER COMPONENTS - Evaluation Module, Laser Diode Driver, Integrated Reverse Polarity Protection for IC & Laser Diode LASER DIODE DRIVER, DEV KIT; Kit Application Type:Drivers; Silicon Manufacturer:Laser Components; Silicon Core Number:-; Application Sub Type:Laser Diode Driver; Kit Contents:Evaluation Board WK Module; Product Range:-; SVHC:No SVHC (15-Jan-2019); Featur |
More stock available week commencing 8/5/19 |
Each |
1+ RM43.01 10+ RM40.22 25+ RM35.56 |
|||
AMG8834EK
|
PANASONIC - Evaluation Board, AMG8834 Infrared Grid-EYE Array Sensor, PAN1740 Bluetooth Low Energy Module GRID-EYE SENSOR BOARD; Kit Application Type:Sensor; Silicon Manufacturer:Panasonic; Silicon Core Number:AMG8834; Application Sub Type:Infrared Array Sensor; Kit Contents:Grid-EYE Sensor Board, ATSAMD21- SMART, Bluetooth Module; Product Range:-; SVHC:No S |
More stock available week commencing 9/16/19 |
Each |
1+ RM320.98 |
|||
BRKT-STBC-AGM01
|
NXP - Development Platform, FXAS21002C & FXOS8700C 9-Axis Solution, Sensor Shield and Breakout Board BREAKOUT BOARD, FREEDOM INERTIAL SENSOR; Silicon Manufacturer:NXP; Core Architecture:ARM; Core Sub-Architecture:Cortex-M4; Silicon Core Number:FXAS21002C, FXOS8700CQ; Silicon Family Name:-; For Use With:NXP FRDM-K64F-AGM01 Demonstration kit; Kit Contents |
|
Each |
1+ RM65.00 |
|||
FRDM-FXS-MULT2-B
|
NXP - Evaluation Module, MMA8652FC/FXAS21002C/MPL3115A2 3-Axis Accelero/Magneto/Gyroscope DEV BOARD, FREEDOM PLATFORM; Kit Application Type:Sensing - Navigation, Position; Silicon Manufacturer:NXP; Silicon Core Number:FXLS8471Q, MAG3110, FXAS21002C, MMA8652FC, MPL3115A2, FXOS8700CQ, MMA9553L; Application Sub Type:Sensor; Kit Contents:Freedom |
More stock available week commencing 6/1/20 |
Each |
1+ RM523.31 |
|||
MAX31855PMB1#
|
MAXIM INTEGRATED PRODUCTS - Evaluation Module, MAX31855 K-Type Thermocouple to Digital Converter, 14-Bit Output DEV BOARD, THERMOCOUPLE-DIGITAL; Kit Application Type:Sensing - Temperature; Silicon Manufacturer:Maxim Integrated Products; Silicon Core Number:MAX31855; Application Sub Type:Thermocouple to Digital Converter; Kit Contents:Dev Board MAX31855( K Type The |
|
Each |
1+ RM101.53 |
|||
SEK001
|
HONEYWELL - Evaluation Kit, Trustability Pressure Sensors, Digital Output SENSOR EVALUATION KIT, PRESSURE SENSOR; Kit Application Type:Sensor; Silicon Manufacturer:Honeywell; Silicon Core Number:-; Application Sub Type:Board Mount Pressure Sensors; Kit Contents:Sensor Evaluation Kit; Product Range:-; SVHC:No SVHC (07-Jul-2017) |
More stock available week commencing 9/2/19 |
Each |
1+ RM38.96 |
|||
SI7057-EVB
|
SILICON LABS - Evaluation Kit, Si705x Processor Family, Temperature Sensor, USB Dongle Form Factor EVAL BOARD, DIGITAL TEMPERATURE SENSOR; Kit Application Type:Sensor; Silicon Manufacturer:Silicon Laboratories; Silicon Core Number:Si7057, Si7058 & Si7059; Application Sub Type:Temperature Sensor; Kit Contents:USB Dongle Control & Si7057-EB Postage Stam |
More stock available week commencing 7/29/19 |
Each |
1+ RM299.66 |
|||
EVAL-ADXL377Z
|
ANALOG DEVICES - Breakout Board, ADXL377 3-Axis High g Analog MEMS Accelerometer EVALUATION BOARD, 3 AXIS ACCEL; Kit Application Type:Sensing - Navigation, Position; Silicon Manufacturer:Analog Devices; Silicon Core Number:ADXL377; Application Sub Type:Accelerometer - Three-Axis; Kit Contents:Evaluation Board ADXL377; Product Range:A |
|
Each |
1+ RM171.33 |
|||
DM160225
|
MICROCHIP - Evaluation Board, PC Peripheral, 3DTouchPad, Extends 2D Touch Pad with 3D Gestures DEV BOARD, PCAP SENSOR 3D TOUCH PAD; Kit Application Type:Sensing - Touch, Proximity; Silicon Manufacturer:Microchip; Silicon Core Number:MTCH63104, MGC3130; Application Sub Type:3D Tracking & Gesture Controller; Kit Contents:3DTouchPad, USB Cable, Infor |
More stock available week commencing 8/26/19 |
Each |
1+ RM493.82 |
|||
OM13081UL
|
NXP - Evaluation Module, LPC82x Capacitive Touch Solution, 8-Bit Touchpad, 9 Keys, LCD DEMO BOARD, CAP TOUCH SOLUTION; Kit Application Type:Sensing - Touch, Proximity; Silicon Manufacturer:NXP; Silicon Core Number:LPC824; Application Sub Type:Capacitive Touch; Kit Contents:Dev Board LPC824, LPC82x Touch Shield, USB Cable; Product Range:-; |
More stock available week commencing 7/22/19 |
Each |
1+ RM132.18 |
|||
LDC1000EVM
|
TEXAS INSTRUMENTS - Evaluation Module, LDC1000 Inductance to Digital Converter for Inductive Sensing Applications, 5V INDUCTIVE SENSING, EVALUATION BOARD; Kit Application Type:Data Converter; Silicon Manufacturer:Texas Instruments; Silicon Core Number:LDC1000; Application Sub Type:Inductance to Digital Converter; Kit Contents:Evaluation Board LDC1000; Product Range:-; S |
No Longer Stocked |
|
|
|||
XTRINSIC-SENSORS-EVK
|
NXP - Evaluation Kit for NXP Xtrinsic Sensors using FRDM-KL25Z Platform EVAL KIT, XTRINSIC SENSOR + KL25 BOARD; Kit Application Type:Sensing - Sampling Kit / Related Components; Silicon Manufacturer:NXP; Silicon Core Number:KL25Z, MAG3110, MMA8491, MPL3115; Application Sub Type:-; Kit Contents:Xtrinsic Sensor Board, Freedom |
|
Each
Available until stock is exhausted
|
1+ RM108.66 |
|||
FDC2114EVM .
|
TEXAS INSTRUMENTS - Evaluation Module, FDC2114 12-Bit Capacitive Sensing Solution, Proximity Sensing, 4 Channel EVAL BOARD, FDC2114 CAP-TO-DIGITAL CONV; Kit Application Type:Sensing - Touch, Proximity; Silicon Manufacturer:Texas Instruments; Silicon Core Number:MSP430F5528, FDC2114; Application Sub Type:Capacitance-to-Digital Converter; Kit Contents:Evaluation Boa |
|
Each
Available until stock is exhausted
|
1+ RM183.41 |
|||
SENSEKIT2-EVK-101
|
ROHM - Evaluation Kit, LAPIS MCU, 6x Analog and Digital Ambient Light Sensor IC's, Hot Pluggable Design EVAL BOARD, ML610Q112 SENSOR PLATFORM; Kit Application Type:Sensor; Silicon Manufacturer:-; Silicon Core Number:ML610Q112, BU52011HFV, BH1620FVC, BH1721FVC, ML8511, KMX61, BDE0600G; Application Sub Type:Embedded; Kit Contents:Sensor Platform Base Board, |
|
Each
Available until stock is exhausted
|
1+ RM138.18 |
|||
FDC1004QEVM .
|
TEXAS INSTRUMENTS - Evaluation Module, FDC1004-Q1 Automotive 4-Channel Capacitive to Digital Converter, Plug & Play EVAL BRD, FDC1004-Q1 CAP-TO-DIGITAL CONV; Kit Application Type:Sensor Signal Conditioner; Silicon Manufacturer:Texas Instruments; Silicon Core Number:MSP430F5528IRGCT, FDC1004-Q1; Application Sub Type:Capacitance-to-Digital Converter; Kit Contents:Eval B |
No Longer Stocked |
|
|
|||
OPT3001EVM .
|
TEXAS INSTRUMENTS - Evaluation Module, OPT3001 Ambient Light Sensor, Digital Output Integrated Circuit EVALUATION BOARD, LIGHT SENSOR; Kit Application Type:Sensing - Navigation, Position; Silicon Manufacturer:Texas Instruments; Silicon Core Number:OPT3001; Application Sub Type:Light to Digital Converter; Kit Contents:Eval Board OPT3001, SM-USB DIG Board, |
No Longer Stocked |
|
|
|||
FDC2214EVM .
|
TEXAS INSTRUMENTS - Evaluation Module, FDC2214 28-Bit Capacitance to Digital Converter, Small Form Factor EVAL BRD, FDC2214 CAPACITANCE TO DIGITAL; Kit Application Type:Sensing - Touch, Proximity; Silicon Manufacturer:Texas Instruments; Silicon Core Number:MSP430F5528, FDC2214; Application Sub Type:Capacitance-to-Digital Converter; Kit Contents:Eval Board MS |
No Longer Stocked |
|
|
|||
LDC0851EVM .
|
TEXAS INSTRUMENTS - Evaluation Module, LDC0851 High Accuracy Inductive Switch, Stacked Coil, Push / Pull Output EVALUATION BOARD, INDUCTIVE SWITCH; Kit Application Type:Sensing - Touch, Proximity; Silicon Manufacturer:Texas Instruments; Silicon Core Number:LDC0851; Application Sub Type:Inductive Proximity Switch; Kit Contents:Eval Board LDC0851, USB Cable; Product |
No Longer Stocked |
|
|
|||
ADPD105BCPZ
|
ANALOG DEVICES - PHOTOMETRIC FRONT END, LFCSP-28 PHOTOMETRIC FRONT END, LFCSP-28; IC Function:Photometric Front End; Supply Voltage Min:1.7V; Supply Voltage Max:1.9V; IC Package Type:LFCSP; No. of Pins:28Pins; Operating Temperature Min:-40°C; Operating Temperature Max:85°C; Product Range:-; MSL:MSL 3 - |
No Longer Stocked |
|
|
|||
LDC1612EVM .
|
TEXAS INSTRUMENTS - Evaluation Module, LDC1612 12-Bit Inductance to Digital Converter, Sample PCB Sensor Coils EVAL BOARD, LDC1612; Kit Application Type:Sensing - Navigation, Position; Silicon Manufacturer:Texas Instruments; Silicon Core Number:MSP430F5528, LDC1612; Application Sub Type:Sensor; Kit Contents:Eval Board LDC1612; Product Range:-; SVHC:No SVHC (27-Ju |
No Longer Stocked |
|
|
|||
EK-H5
|
SENSIRION - Evaluation Kit for SHT2x and SHT7x Humidity and Temperature Sensors EVALUATION KIT, HUMIDITY, FOR SHT2X/7X; Kit Application Type:Sensor; Silicon Manufacturer:Sensirion; Silicon Core Number:SHT21; Application Sub Type:Humidity Sensor; Kit Contents:EK-H5 USB Stick, SHT21 Sensor, Sensor Cable; Product Range:-; SVHC:No SVHC |
No Longer Manufactured |
|
|
