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TS391LT10
Solder Paste, Synthetic No Clean, 138 °C Melting Temperature, 42, 57.6, 0.4 Sn, Bi, Ag Alloy, 35g
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| Quantity | Price |
|---|---|
| 1+ | RM150.930 |
| 3+ | RM143.590 |
Price for:Each
Minimum: 1
Multiple: 1
RM150.93
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Product Information
ManufacturerCHIP QUIK
Manufacturer Part NoTS391LT10
Order Code4715898
Technical Datasheet
Flux TypeSynthetic No Clean
Solder Alloy0
Melting Temperature138°C
Weight - Metric35g
Weight - Imperial1.23oz
Product Range-
SVHCNo SVHC (21-Jan-2025)
Product Overview
Thermally stable, no-clean solder paste, lead-free in 10cc syringe with plunger and tip.
- Revolutionary formula - no refrigeration required
- Printing speeds up to 125mm/sec
- Long stencil life
- Wide process window
- Clear residue
- Low voiding
- Excellent wetting compatibility on most board finishes
- Dispense grade
- Compatible with enclosed print heads
Technical Specifications
Flux Type
Synthetic No Clean
Melting Temperature
138°C
Weight - Imperial
1.23oz
SVHC
No SVHC (21-Jan-2025)
Solder Alloy
0
Weight - Metric
35g
Product Range
-
Technical Docs (1)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:Canada
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:Canada
Country in which last significant manufacturing process was carried out
Tariff No:83113000
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (21-Jan-2025)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.05