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IS21ES08GA-JCLI
Flash Memory, eMMC NAND, 8 GB, Parallel, FBGA, 153 Pins
Image is for illustrative purposes only. Please refer to product description.
ManufacturerINTEGRATED SILICON SOLUTION / ISSI
Manufacturer Part NoIS21ES08GA-JCLI
Order Code4176665
Product Range3.3V eMMC NAND Flash Memories
Technical Datasheet
Available to Order
Manufacturer Standard Lead Time: 12 week(s)
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| Quantity | Price |
|---|---|
| 1+ | RM84.120 |
| 10+ | RM73.610 |
| 25+ | RM62.450 |
Price for:Each
Minimum: 1
Multiple: 1
RM84.12
Line Note
Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
Product Information
ManufacturerINTEGRATED SILICON SOLUTION / ISSI
Manufacturer Part NoIS21ES08GA-JCLI
Order Code4176665
Product Range3.3V eMMC NAND Flash Memories
Technical Datasheet
Flash Memory TypeeMMC NAND
Memory Density8GB
Memory Configuration-
InterfacesParallel
IC Case / PackageFBGA
No. of Pins153Pins
Clock Frequency Max200MHz
Access Time-
Supply Voltage Min2.7V
Supply Voltage Max3.6V
Supply Voltage Nom3.3V
IC MountingSurface Mount
Operating Temperature Min-40°C
Operating Temperature Max85°C
Product Range3.3V eMMC NAND Flash Memories
SVHCNo SVHC (16-Jul-2019)
Product Overview
IS21ES08GA-JCLI is a managed MLC NAND flash memory with eMMC 5.0 interface. It is ideal for embedded storage solutions for industrial application, which require high performance across a wide range of operating temperatures. eMMC encloses the MLC NAND and eMMC controller inside as one JEDEC standard package, providing a standard interface to the host. The eMMC controller directly manages NAND flash, including ECC, wear-levelling, IOPS optimization and read sensing.
- Compliant with eMMC specification Ver.4.4, 4.41,4.5,5.0
- Bus mode, high-speed eMMC protocol, clock frequency is 0-200MHz
- Ten-wire bus (clock, 1 bit command, 8 bit data bus) and a hardware reset
- Operating voltage range is VCCQ = 1.8V/3.3V, VCC = 3.3V
- Internal error correction code (ECC) to protect data communication
- Solid protection from sudden power failure, safe-update operations for data content
- Support secure bad block erase and trim commands
- Field firmware update (FFU), boot partition and RPMB partition, enhanced device life time
- Pre EOL information, production state awareness, power off notification for sleep
- 64Gbx1 NAND flash, 153 FBGA package, Industrial operating temperature range from -40°C to 85°C
Technical Specifications
Flash Memory Type
eMMC NAND
Memory Configuration
-
IC Case / Package
FBGA
Clock Frequency Max
200MHz
Supply Voltage Min
2.7V
Supply Voltage Nom
3.3V
Operating Temperature Min
-40°C
Product Range
3.3V eMMC NAND Flash Memories
SVHC
No SVHC (16-Jul-2019)
Memory Density
8GB
Interfaces
Parallel
No. of Pins
153Pins
Access Time
-
Supply Voltage Max
3.6V
IC Mounting
Surface Mount
Operating Temperature Max
85°C
MSL
MSL 3 - 168 hours
Technical Docs (1)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:Taiwan
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:Taiwan
Country in which last significant manufacturing process was carried out
Tariff No:85423275
US ECCN:3A991.b.1.a
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (16-Jul-2019)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.001361