CT-L63-S0515

The CT-L63-S0515 is a no-clean pin Probe Testable Solder Paste has been developed to offer extremely broad process windows for printing, wetting and pin probe testing. The superior wetting ability of NC254 results in bright, smooth and shiny, solder joints. It offers very low post process residues, which remain crystal clear and probable even at the elevated temperatures required for today's lead free alloys. It has shown to reduce or eliminate voiding under micro-BGAs. It also offers high humidity tolerance and a chemistry developed for use in air reflow. Slump and humidity tolerances found in this extend the solder pastes useable life in facilities where environmental control is not at its optimum.

• Broad printing process window
• Clear pin-probe testable residue
• Reduces voiding under micro-BGAs
• Excellent wetting

Applications

Maintenance & Repair

Warnings

Do not store new and used paste in the same container and reseal any opened containers while not in use.