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BP100-0.005-00-1/1 - 

Thermal Adhesive Tape, Bond-Ply® 100, 0.8 W/m.K, 0.005 "

BP100-0.005-00-1/1 - Thermal Adhesive Tape, Bond-Ply® 100, 0.8 W/m.K, 0.005 "

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Product Overview

  • Can be used to mount heat sink onto a graphics/ drive processor or heat spreader onto a PCB
  • Thermal impedance: 0.86°C - in²/W (@ 100 psi)
  • High bond strength to a variety of surfaces
  • Double-sided pressure sensitive adhesive tape
  • High performance, thermally conductive acrylic adhesive
  • Can be used instead of heat cure adhesive, screw mounting or clip mounting

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415 In stock

151 available for 1 - 2 business days delivery
264 available for 3 - 4 business days delivery
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More stock available week commencing 3/16/20


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Multiple: 1 Minimum: 1
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1+ RM13.54
10+ RM13.03
25+ RM12.28

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