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BOND PLY TBP 850
Thermal Adhesive Tape, Bond-Ply® 100, 0.8 W/m.K, 0.005 " TH, 1" x 1" Sheet
Image is for illustrative purposes only. Please refer to product description.
No Longer Stocked
Product Overview
- Can be used to mount heat sink onto a graphics/ drive processor or heat spreader onto a PCB
- Thermal impedance: 0.86℃ - in²/W (@ 100 psi)
- High bond strength to a variety of surfaces
- Double-sided pressure sensitive adhesive tape
- High performance, thermally conductive acrylic adhesive
- Can be used instead of heat cure adhesive, screw mounting or clip mounting
Technical Specifications
Thermal Conductivity
0.8W/m.K
Thickness
0.005"
Dielectric Strength
-
External Width
25.4mm
SVHC
No SVHC (25-Jun-2025)
Conductive Material
-
Thermal Impedance
-
External Length
25.4mm
Product Range
-
Technical Docs (2)
Associated Products
1 Product Found
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Tariff No:85479000
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:To be advised
SVHC:No SVHC (25-Jun-2025)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.004082