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BP100-0.005-00-12/12

Thermal Adhesive Tape, Bond-Ply® 100, 0.8 W/m.K, 0.005 "

BP100-0.005-00-12/12 - Thermal Adhesive Tape, Bond-Ply® 100, 0.8 W/m.K, 0.005 "

Image is for illustrative purposes only. Please refer to product description.

Manufacturer:
BERGQUIST BERGQUIST
Manufacturer Part No:
BP100-0.005-00-12/12
Order Code:
8783713
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Product Information

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0.8W/m.K

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-

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0.005"

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-

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-

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-

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300mm

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Technical Docs (2)

Product Overview

  • Can be used to mount heat sink onto a graphics/ drive processor or heat spreader onto a PCB
  • Thermal impedance: 0.86°C - in²/W (@ 100 psi)
  • High bond strength to a variety of surfaces
  • Double-sided pressure sensitive adhesive tape
  • High performance, thermally conductive acrylic adhesive
  • Can be used instead of heat cure adhesive, screw mounting or clip mounting

92 In stock Need more?

92 available for 3 - 4 business days delivery

RM122.49

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