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MT62F3G32D8DV-023 AAT:B
DRAM, LPDDR5, 96 Gbit, 3G x 32bit, FBGA
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| Quantity | Price |
|---|---|
| 1+ | RM1,045.510 |
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Multiple: 1
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Product Information
ManufacturerMICRON
Manufacturer Part NoMT62F3G32D8DV-023 AAT:B
Order Code4163491
Technical Datasheet
DRAM TypeLPDDR5
Memory Density96Gbit
Memory Configuration3G x 32bit
Clock Frequency Max-
IC Case / PackageFBGA
No. of Pins-
Supply Voltage Nom-
IC MountingSurface Mount
Operating Temperature Min-40°C
Operating Temperature Max105°C
Product Range-
Product Overview
- Mobile LPDDR5/LPDDR5X SDRAM
- 17.1GB/s maximum bandwidth per channel, selectable CKR (WCK:CK = 2:1 or 4:1) architecture
- Background ZQ calibration/command-based ZQ calibration, link protection (link ECC) support
- I/O type: Low-swing single-ended, VSS terminated, VOH-compensated output drive, DVFSQ support
- Dynamic voltage frequency scaling core, single-ended CK, single-ended WCK, and single-ended RDQS
- Operating voltage is 1.05V VDD2H / 0.5V VDDQ
- 3 Gig x 32 configuration, 8 die
- 315-ball LFBGA package
- 12GB (96Gb) total density, 8533Mb/s data rate per pin
- AEC-Q100 automotive qualified, -40°C ≤ TC ≤ +105°C operating temperature
Technical Specifications
DRAM Type
LPDDR5
Memory Configuration
3G x 32bit
IC Case / Package
FBGA
Supply Voltage Nom
-
Operating Temperature Min
-40°C
Product Range
-
Memory Density
96Gbit
Clock Frequency Max
-
No. of Pins
-
IC Mounting
Surface Mount
Operating Temperature Max
105°C
Technical Docs (1)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:Taiwan
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:Taiwan
Country in which last significant manufacturing process was carried out
Tariff No:85423290
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.008845