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Quantity | Price |
---|---|
1+ | RM46.410 |
10+ | RM40.800 |
100+ | RM34.920 |
Product Information
Product Overview
Molex's SpeedEdge Edge-Card connector system is rugged enough to mate safely with large PCBs in high-cycle applications while providing a high-density, low-profile solution with data rates to over 40 Gbps per differential pair. They are mechanically robust with thicker walls and higher stack height when compared to other mezzanine systems and securely hold thick PCBs; delivers durability and high-mating cycles. The Split-pad PCB design allows for electrical tuning performance to reach data rates to over 40 Gbps per differential pair.
- Voltage (max) is 250VAC
- Current (max) is 1.0A per pin
- Contact resistance is 20mohm
- Dielectric withstanding voltage is 300VAC
- Insulation resistance is 10Mohm
Applications
Communications & Networking, Consumer Electronics, Aerospace, Defence, Military, Medical
Technical Specifications
Dual Side
60 Contacts
Straight
Copper Alloy
LCP (Liquid Crystal Polymer) Body
No SVHC (21-Jan-2025)
1.57mm
Surface Mount
Solder
30µ" Gold Plated Contacts
SpeedEdge 173300
Technical Docs (3)
Legislation and Environmental
Country in which last significant manufacturing process was carried outCountry of Origin:China
Country in which last significant manufacturing process was carried out
RoHS
RoHS
Product Compliance Certificate