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Quantity | Price |
---|---|
1+ | RM108.410 |
10+ | RM105.120 |
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RM108.41
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Product Information
ManufacturerMICRON
Manufacturer Part NoMT62F768M32D2DS-023 WT:B
Order Code4163500
DRAM TypeMobile LPDDR5
Memory Density24Gbit
Memory Configuration768M x 32bit
Clock Frequency Max4.266GHz
IC Case / PackageFBGA
No. of Pins-
Supply Voltage Nom1.05V
IC MountingSurface Mount
Operating Temperature Min-25°C
Operating Temperature Max85°C
Product Range-
Product Overview
- Mobile LPDDR5/LPDDR5X SDRAM
- 17.1GB/s maximum bandwidth per channel, selectable CKR (WCK:CK = 2:1 or 4:1) architecture
- Background ZQ calibration/command-based ZQ calibration, link protection (link ECC) support
- I/O type: Low-swing single-ended, VSS terminated, VOH-compensated output drive, DVFSQ support
- Dynamic voltage frequency scaling core, single-ended CK, single-ended WCK, and single-ended RDQS
- Operating voltage is 1.05V VDD2H / 0.5V VDDQ
- 768 Meg x 32 configuration, 2 die
- 315-ball TFBGA package
- 3GB (24Gb) total density, 8533Mb/s data rate per pin
- Operating temperature rating range from -25°C ≤ Tc ≤ +85°C
Technical Specifications
DRAM Type
Mobile LPDDR5
Memory Configuration
768M x 32bit
IC Case / Package
FBGA
Supply Voltage Nom
1.05V
Operating Temperature Min
-25°C
Product Range
-
Memory Density
24Gbit
Clock Frequency Max
4.266GHz
No. of Pins
-
IC Mounting
Surface Mount
Operating Temperature Max
85°C
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:Taiwan
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:Taiwan
Country in which last significant manufacturing process was carried out
Tariff No:85423290
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.005411