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A15324-01 - 

Thermal Pad, Tflex 300 Series, 1.2 W/m.K, Silicone Elastomer, 1 mm, 229 mm

A15324-01 - Thermal Pad, Tflex 300 Series, 1.2 W/m.K, Silicone Elastomer, 1 mm, 229 mm

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Manufacturer Part No:
Order Code:
Product Range
Tflex 300 Series
Technical Datasheet:
A15324-01   Datasheet
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Product Information

Silicone Elastomer
Tflex 300 Series
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Product Overview

The A15324-01 is a 1mm Thermal Gap Filler with unique silicone gel offers compliancy and thermal resistance at pressures of 50psi will deflect to over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex™ 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2W/mK, low thermal resistances can be achieved at low pressures. Tflex™ 300-H is offered with a hard, metalized liner option for easy handling and improved rework. The metalized liner's lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis. It is suitable for flat panel displays, memory modules, set top box, lighting ballast, handheld electronics, optical disk drives and vibration dampening applications.
  • Extreme compliancy allows material to totally blanket components
  • Low compression set enables the pad to be reused many times
  • UL94V-0 Flammability rating
  • -40 to 160°C Operating temperature
  • ±10% Thickness tolerance
  • 0.56% Out-gassing TML
  • 0.10% Out-gassing CVCM
  • 600ppm/c Coefficient thermal expansion (CTE)


Thermal Management, Communications & Networking, Computers & Computer Peripherals, Power Management, Lighting, LED Lighting, Automotive

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200 In stock

200 available for 3 - 4 business days delivery
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More stock available week commencing 1/6/20


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1+ RM53.24
5+ RM51.80
10+ RM50.26
25+ RM47.33
50+ RM44.39
100+ RM41.41

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